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  <div class="vevent h-event"> <h1 class="summary p-name">Oregon CPMT/CAS - Global Trends & Technology Developments in Embedded Packaging</h1> <div class='date'><time class="dtstart dt-start" title="2010-05-26T18:00:00" datetime="2010-05-26T18:00:00">Wednesday, May 26, 2010 from 6</time>–<time class="dtend dt-end" title="2010-05-26T20:00:00" datetime="2010-05-26T20:00:00">8pm</time></div> <div class="location vcard p-location h-card"> <a class="url" href='http://calagator.org/venues/202392060'><span class='fn org p-name'>Capital Center</span></a> <div class="adr p-adr h-adr"> <div class="street-address p-street-address">18640 Nw Walker Rd</div> <span class="locality p-locality">Beaverton</span> , <span class="region p-region">OR</span> <span class="postal-code p-postal-code">97006</span> <div class="country-name p-country-name">US</div> (<a href='https://maps.google.com/maps?q=18640%20Nw%20Walker%20Rd,%20Beaverton%20OR%2097006%20US'>map</a>) </div> </div> <div class="description p-description"> <p>Topic: Global Trends & Technology Developments in Embedded Packaging Speaker: Chuck Bauer, TechLead Corp. Date: Wednesday, May 26, 2010 Time: 6-8pm; Chapter election will be held</p> <pre><code> 6.00-6.30 pizza/social; 6.30-8.00 presentation, Q+A </code></pre> <p>Location: Capital Center Room 1301, 18640 NW Walker Road, Beaverton, OR 97006.</p> <pre><code> Enter the building using entrance E. See <a href="http://www.mapquest.com/maps?city=Beaverton&state=OR&address=18640+NW+Walker+Rd">http://www.mapquest.com/maps?city=Beaverton&state=OR&address=18640+NW+Walker+Rd</a> </code></pre> <p>Abstract:</p> <p>Embedding active devices in the circuit board offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development, these benefits come at a price: disrupted logistics, altered partitioning & design constraints, yield management considerations, and limited rework and repair options.</p> <p>After a brief review of embedded packaging drivers this presentation looks at the leading commercial and developmental approaches from around the world emphasizing the various approaches to overcoming the barriers mentioned in the previous paragraph. Examples of specific embedded package structures, including GE’s ECBU, Verdant’s Occam, Infineon’s TWLP, Freescale’s RCP, Casio’s EWLP, Shinko’s EOP, and Imbera’s IMB technologies, demonstrate both the power and limitations of these approaches. Next, the presentation treats practical implementation challenges such as yield management strategies and supply chain restructuring. Finally, the presentation concludes with an assessment of the outlook for embedded packaging.</p> <p>Speaker:</p> <p>Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry. Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, particularly in the international arena.</p> <p>Directions:</p> <p>See <a href="http://www.mapquest.com/maps?city=Beaverton&state=OR&address=18640+NW+Walker+Rd">http://www.mapquest.com/maps?city=Beaverton&state=OR&address=18640+NW+Walker+Rd</a></p> <p>Speaker(s): Charles E. Bauer, Senior Managing Director ,</p> <p>Agenda: 6.00-6.30 pizza/social Chapter Election will be held. 6.30-8.00 presentation, Q+A</p> <p>Location: Room: Room 1301 Bldg: Capital Center 18640 NW Walker Road Beaverton, Oregon 97006</p> </div> </div>